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NXP Semiconductors
IP4350CX24
9-channel SD memory card interface ESD protection ?lter
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and ?ux residues
and/or under?ll removed. When a new chip is placed on the substrate, use the ?ux
process instead of solder on the solder lands. Apply ?ux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To re?ow the solder, use the solder pro?le shown in application note
AN10365 “Surface mount re?ow soldering description”.
10.3.4 Cleaning
Cleaning can be done after re?ow soldering.
11. Abbreviations
Table 8.
Acronym
DUT
EMI
ESD
NWA
PCB
PCS
RFI
RoHS
SD
12. Revision history
Abbreviations
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
NetWork Analyzer
Printed-Circuit Board
Personal Communication System
Radio Frequency Interference
Restriction of Hazardous Substances
Secure Digital
Table 9.
Revision history
Document ID
IP4350CX24_1
Release date
20100205
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
IP4350CX24_1
? NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 5 February 2010
13 of 16
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相关代理商/技术参数
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